Article(electronic)March 2014

Effects of TiO2 nanoparticles addition on microstructure, microhardness and tensile properties of Sn–3.0Ag–0.5Cu–xTiO2 composite solder

In: Materials & Design, Volume 55, p. 574-582

Tang, Y.; Li, G.Y.; Pan, Y.C.

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Languages

English

Publisher

Elsevier BV

DOI

10.1016/j.matdes.2013.10.033

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